United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), a global semiconductor foundry, has announced that the company has satisfied all closing conditions, including final approval from all relevant government agencies, for the full acquisition of Mie Fujitsu Semiconductor Limited (MIFS), the former 300mm wafer foundry joint venture between UMC and Fujitsu Semiconductor Limited (FSL), the company said.
In 2014, FSL and UMC agreed for UMC to acquire a 15.9% stake in MIFS from FSL through progressive phases. FSL is now cleared to transfer the remaining 84.1% of its shares in MIFS to UMC, with a final transaction value to acquire the remaining shares totaling ¥ JPN 54.4 billion. As a wholly owned subsidiary of the Taiwan-based foundry, MIFS will be renamed as United Semiconductor Japan Co., Ltd. (USJC).
In addition to the equity investment in MIFS, FSL and UMC have had a mutually beneficial partnership through licensing of UMC´s 40nm technology and establishment of a 40nm logic production line at MIFS. After several years of joint operations, both companies agreed on the benefits of integrating MIFS into UMC to strengthen UMC´s business foundation as a global semiconductor foundry with a broad customer portfolio, enhanced manufacturing expertise and extensive technology offerings, enabling MIFS to maximize its potential, enhance Japan´s semiconductor industry competiveness and drive values to UMC´s stakeholders.
UMC is a global semiconductor foundry. The company provides mature and advanced IC production with a focus on Specialty Technologies to manufacture ICs for applications spanning every major sector of the electronics industry. UMC´s comprehensive foundry solutions enable chip designers to leverage the company´s sophisticated technology and manufacturing, which include high volume 28nm High-K/Metal Gate technology, volume production 14nm FinFET, specialty process platforms specifically developed for AI, 5G and IoT applications and the automotive industry´s highest-rated AEC-Q100 Grade-0 manufacturing capabilities for the production of ICs found in vehicles. UMC´s 11 wafer fabs are strategically located throughout Asia and are able to produce more than 600,000 wafers per month. The company employs approximately 18,500 people worldwide, with offices in Taiwan, China, Europe, Japan, Korea, Singapore, and the United States. UMC can be found on the web at http://www.umc.com.