Toshiba Electronic Devices & Storage Corporation has announced a new 130nm manufacturing process node based FFSAâ¢ (Fit Fast Structured Array), an innovative custom SoC development platform featuring high performance, low cost and low power consumption, the company said.
Toshiba provides ASIC (Application Specific IC) and FFSAâ¢ platforms that suit the customer´s business environment and requirements, that also deliver efficient solutions for custom SoC development. FFSAâ¢ devices use a silicon-based master slice which is common in combination with upper metal layers that are reserved for customization.
By customizing only a few masks, FFSAâ¢ offers much lower NRE costs than individual ASIC development. It also enables significant reductions in development cost and provides samples and mass-production in a short period of time than for conventional ASIC´s. Additionally, FFSAâ¢ enables higher performance and lower power consumption than FPGA (Field Programmable Gate Array) using ASIC design methodology and its library.
The 130nm process series joins Toshiba´s current 28nm, 40nm, and 65nm process portfolio making FFSAâ¢ a suitable option for the growing industrial equipment market.
The 130nm FFSAâ¢ devices designed on the platform will be manufactured by Japan Semiconductor, a subsidiary of Toshiba Electronic Devices & Storage Corporation with a long and proven history of expertise in manufacturing ASIC, ASSP and microcomputers. This will ensure long-term supply and meet the needs of customer business continuity plans.
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