Toshiba unveils development platform

Toshiba Electronic Devices & Storage Corporation has announced a new 130nm manufacturing process node based FFSAâ„¢ (Fit Fast Structured Array), an innovative custom SoC development platform featuring high performance, low cost and low power consumption, the company said.

Toshiba provides ASIC (Application Specific IC) and FFSAâ„¢ platforms that suit the customer´s business environment and requirements, that also deliver efficient solutions for custom SoC development. FFSAâ„¢ devices use a silicon-based master slice which is common in combination with upper metal layers that are reserved for customization.

By customizing only a few masks, FFSAâ„¢ offers much lower NRE costs than individual ASIC development. It also enables significant reductions in development cost and provides samples and mass-production in a short period of time than for conventional ASIC´s. Additionally, FFSAâ„¢ enables higher performance and lower power consumption than FPGA (Field Programmable Gate Array) using ASIC design methodology and its library.

The 130nm process series joins Toshiba´s current 28nm, 40nm, and 65nm process portfolio making FFSAâ„¢ a suitable option for the growing industrial equipment market.

The 130nm FFSAâ„¢ devices designed on the platform will be manufactured by Japan Semiconductor, a subsidiary of Toshiba Electronic Devices & Storage Corporation with a long and proven history of expertise in manufacturing ASIC, ASSP and microcomputers. This will ensure long-term supply and meet the needs of customer business continuity plans.

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