Silex Technology launches 802.11ac SDIO module for mass-market wireless

Silex Technology America, Inc., a global provider of wired and wireless networking solutions, has announced the newest member of the SX-SDMAC family, the SX-SDMAC Plus wireless module, the company said.

Based on QCA9377-3 System-on-Chip (SoC) from Qualcomm Technologies, Inc., this dual-band IEEE 802.11a/b/g/n/ac WLAN plus Bluetooth 4.2 SDIO module has a new streamlined design that delivers enterprise-grade Wi-Fi connectivity with link rates as high as 433 Mbps.

The SX-SDMAC Plus fulfills a strategic role in Silex Technology´s embedded wireless product portfolio, opening new opportunities and markets. The current SX-SDPAC System-in-Package (SiP) solution offers the smallest form factor for IEEE 802.11ac plus Bluetooth connectivity. However, it requires additional engineering development of RF front-end circuitry and certification. On the other hand, the SX-SDMAC module series provides support for industrial temperature range, long product life cycle, and software antenna diversity.

The newly announced SX-SDMAC Plus takes the best of both product categories — smallest form factor in the SX-SDMAC module family, extended temperature range, and product longevity. The new design also has higher transmit output power than the SX-SDMAC, thus increasing the Wi-Fi network range for increased coverage and performance.

Silex Technology builds on more than 40 years of hardware and software connectivity know-how and IP, custom design development experience, and in-house manufacturing capabilities, bringing value to customers with a foundation of technical expertise. With relentless attention to quality, exclusive access to Qualcomm Atheros expertise, and strategic partnerships with semiconductor providers, Silex Technology is the global provider of reliable Wi-Fi connectivity for products ranging from a medical device to a document imaging product to a video or digital display. With Silex Technology, customers get a single vendor that provides hardware and software support from design through manufacturing for successful product after successful product. For more information, visit