Saki Corporation, an innovator in the field of automated optical and X-ray inspection and measurement equipment, introduces a compact, lightweight, inline 3D-CT automated X-ray inspection machine, the 3Xi-M110, for inspection of printed circuit board assemblies (PCBAs), the company said.
The 3Xi-M110 reduces the dose and exposure to X-rays during inspection and features new soldering quality inspection functions for PCB assembly applications. Saki will demonstrate the PCB inspection capabilities of the 3Xi-M110 at productronica 2019, being held in Munich, Germany from November 12-15, in stand A2.259.
Saki´s new X-ray inspection system ensures the quality of hidden solder joints for bottom-electrode packages, such as BGAs, LGAs, and QFNs, which are found in advanced embedded devices, telecommunications, and automotive products. Saki´s Planar Computed Tomography (PCT) provides precise volumetric measurements and shape reconstruction to find voids, head-in-pillow (HiP), and other defects that are extremely difficult to identify.
Since its inception in 1994, Saki has led the way in the development of automated recognition through robotic vision technology. Saki´s 3D automated solder paste, optical, and X-ray inspection systems (SPI, AOI, AXI) have been recognized to provide the stable platform and advanced data capture mechanisms necessary for true M2M communication, improving production, process efficiency, and product quality. Saki Corporation has headquarters in Tokyo, Japan, with offices, sales, and support centers around the world.