Onto Innovation Inc. (NYSE: ONTO) has announced that it has received orders totaling 15 systems from two leaders in advanced packaging, the company said.
Both customers are ramping up to support the ongoing demand for 5G smartphones which drives advanced packages requiring more precise process control solutions. Onto Innovation´s 2D inspection systems with integrated machine learning software will be used to help ensure quality and reliability of these-edge products.
Onto Innovation´s inspection solutions integrate high precision sensors with AI software to improve device quality, reliability, and reduce manufacturing costs through machine learning that can make smart decisions and point process engineers to root problems for investigation.
Onto Innovation is a provider of process control, combining global scale with an expanded portfolio of-edge technologies that include: Unpatterned wafer quality; 3D metrology spanning chip features from nanometer scale transistors to large die interconnects; macro defect inspection of wafers and packages; metal interconnect composition; factory analytics; and lithography for advanced semiconductor packaging. Additional information can be found at www.ontoinnovation.com.