NextFlex announces funding round for Flexible Hybrid Electronics innovations in aviation

NextFlex, America´s Flexible Hybrid Electronics (FHE) Manufacturing Institute, has the requested the latest call for proposals to fund projects that seek to further the development and adoption of FHE, the company said.

Response to the first three project calls received 178 initial proposals, resulting in over USD 59M in investment. Along with Project Cll 4.0 (PC 4.0), the latest project call, The total project value is expected to exceed USD 10 million for PC 4.0.

Project Call 4.0´s very diverse scope of needs represents technology and capability gaps that have been determined by the community over a wide range of application areas — from digital health to commercial aviation to national security needs. These areas cover the spectrum from encapsulation technologies for wearables, high performance and high layer count FHE, to 3-dimensional electronic design software, solutions for challenges in e-textiles, biochemical monitoring platforms and lightweight electronics for drones and UAVs.

NextFlex, America´s Flexible Hybrid Electronics Manufacturing Institute, is a leading force in the Manufacturing USA network of Institutes. Formed through a cooperative agreement between the US Department of Defense (DoD) and FlexTech Alliance. NextFlex is a consortium of companies, academic institutions, non-profits and state, local and federal governments with a shared goal of advancing US manufacturing of FHE.

Flexible Hybrid Electronics (FHE) gives everyday products the power of silicon ICs by combining them with new and unique printing processes and new materials.