Nano Dimension files patent for proprietary copper ink material

Nano Dimension (TASE: NNDM, OTCQX: NNDMY) said that Nano Dimension Technologies, a fully owned subsidiary, has filed a patent application with the US Patent and Trademark Office for a proprietary copper ink that is used in the printing of electronic conductors.

The copper nanoparticle-based ink provides improved oxidation resistance, resulting in an innovative breakthrough that offers the ability to print copper with industrial 3D digital printers.

Copper is a highly electrically conductive metal, and its low price gives it a significant advantage in the market when compared to silver. However, copper nanoparticles rapidly oxidize upon contact with air, which impairs the electrical conductivity.

The patent application that the company has filed presents innovative approaches to overcome the problem of copper nanoparticle oxidation. Overcoming this challenge introduces an effective and less costly method for industrial additive manufacturing of printed electronics by 3D printing.

Nano Dimension, founded in 2012, focuses on development of advanced 3D printed electronics systems. Nano Dimension´s unique products combine three advanced technologies: 3D inkjet, 3D software and nanomaterials.