MIPI Alliance releases new transport layer

The MIPI Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, today released MIPI UniPro v1.8, an update to the versatile transport layer that is used to interconnect chipsets and peripheral components in mobile-connected devices, the company said.

MIPI UniPro v1.8 delivers dramatically higher data speeds compared to the previous release and incorporates techniques that ensure the quality of high-throughput transmissions. The first adopter of this latest specification is the JEDEC Solid State Technology Association. JEDEC is using MIPI UniPro v1.8 to provide the interconnection layer for Universal Flash Storage (UFS) version 3.0 memory components deployed in smartphones, tablets and mobile computing products, as well as infotainment platforms and telematics hubs used in automotive systems.

MIPI Alliance (MIPI) develops interface specifications for mobile and mobile-influenced industries. There is at least one MIPI specification in every smartphone manufactured today. Founded in 2003, the organization has 300 member companies worldwide and 13 active working groups delivering specifications within the mobile ecosystem. Members of the organization include handset manufacturers, device OEMs, software providers, semiconductor companies, application processor developers, IP tool providers, test and test equipment companies, as well as camera, tablet and laptop manufacturers. For more information, visit www.mipi.org.