MACOM Technology Solutions Inc. has announced the MAOT-025402 CWDM4 transmitter optical sub-assembly as a part of MACOM´s L-PICâ¢ (Laser-integrated Silicon Photonic Integrated Circuit) solution for 100Gbps CWDM4, the company said.
As the explosive growth of data traffic and insatiable demand forces Cloud Data Centers to rapidly scale their capabilities, MACOM is equipped to be a provider of the transition from 100Gbps to 400Gbps and from 4G to 5G with a cost-effective, high-performance and highly integrated interconnect chipset solution for CWDM4, scalable to FR4 and FR1/DR1 applications.
Core to the MAOT-025402 is the MAOP-L284CN L-PIC device, which integrates four high-performance 25Gbps CWDM wavelengths in a single silicon photonic integrated circuit (PIC) to communicate 100Gbps over duplex single mode fiber. MACOM´s L-PIC platform provides a highly integrated silicon photonic solution targeting specific data center applications that includes four CW lasers, monitor photodiodes, high bandwidth waveguides, modulators and multiplexers. Utilizing MACOM´s patented self-aligning etched facet technology (SAEFTTM) for precision attachment of the lasers to the silicon chip, the L-PIC platform removes the need for active laser alignment and offers a significant cost reduction to the customer, enabling mainstream deployment.
MACOM technology increases the speed and coverage of the mobile Internet and enables fiber optic networks to carry previously unimaginable volumes of traffic to businesses, homes and datacenters.
Headquartered in Lowell, Massachusetts, MACOM is certified to the ISO9001 international quality standard and ISO14001 environmental management standard. MACOM has design centers and sales offices throughout North America, Europe, Asia and Australia.