Longsys Technology launches smallest IoT WiFi SiP module

Longsys Technology said it has introduced the world´s smallest IoT WiFi Silicon-in-package (SiP) module, LTP0201, which is designed for IoT and wearable devices that can connect to other smart devices or directly connect to the Internet for cloud-based data analytics and enhanced services.

With a size of 6mm x 6mm (only 1/10 of the IoT WiFi PCBA modules, or less), this technology IoT SiP module integrated MCU, memory, power management and RF parts, to provide a high performance, low cost, and low power consumption solution for connected products.

The LTP0201 SiP module includes a low power 32-bit RISC MCU, on-chip SRAM and internal SPI NOR Flash, can be applied in a hostless mode (no external MCU) or hosted mode where it connects to an 8/16/32-bit microcontroller through UART/SPI, or SDIO interfaces. It also can be used with sensors and other specific application devices through its GPIOs. The LTP0201 supports 802.11 b/g/n with integrated TCP/IP protocol stack, and supports 1×1 MIMO; the time of waking up to transmit packets is within 2ms, and the standby power consumption is less than 1.0mW in DTIM3 low power mode. For security, it integrates WEP, TKIP, AES, and WAPI HW secure engines.

LTP3226, a WiFi + Bluetooth combo SiP, was announced together with LTP0201. It has a low power 32 bit RISC MCU, on-chip SRAM and internal SPI NOR Flash, and support 802.11 b/g/n, Bluetooth 4.1/BLE.