In his IFA 2018 keynote titled “The Ultimate Power of Mobile AI”, Huawei Consumer Business Group CEO Richard Yu introduced the Kirin 980, the system on a chip (SoC) that will bring about the next evolution of mobile AI, the company said.
As the world´s first commercial SoC manufactured with Taiwan Semiconductor Manufacturer company´s (TSMC) 7nm process, Kirin 980 combines best-in-class performance, efficiency, connectivity features, and Dual NPU AI processing power.
The cutting edge TSMC 7nm process technology enables Kirin 980 to pack 6.9 billion transistors within a 1cm2 die size, 1.6 times of the previous generation. Compared to the 10nm process, the 7nm process delivers 20 percent improved SoC performance and 40 percent improved SoC power efficiency.
Huawei´s products and services are available in more than 170 countries, and are used by a third of the world´s population. Fourteen R&D centers have been set up in the United States, Germany, Sweden, Russia, India and China. Huawei Consumer BG is one of Huawei´s three business units and covers smartphones, PC and tablets, wearables and cloud services, etc. Huawei´s global network is built on almost 30 years of expertise in the telecom industry and is dedicated to delivering the latest technological advances to consumers around the world.