HEICO Corporation (NYSE: HEI.A) (NYSE: HEI) board of directors has declared a regular semi-annual cash dividend of USD 0.08 per share payable on both classes of common stock, the company said.
The cash dividend is payable on July 19, 2017 to shareholders of record as of July 5, 2017.
Since December 2016, the company has cumulatively increased its cash dividend by 25%.
The upcoming cash dividend is HEICO´s 78th consecutive semi-annual cash dividend since 1979 and represents an 11% increase over the prior semi-annual per share amount of USD 0.072 (as adjusted for the company´s 5-for-4 stock split distributed in April 2017). Additionally, HEICO increased its cash dividend by 13% in December 2016.
HEICO is engaged primarily in the design, production, servicing and distribution of products and services to certain niche segments of the aviation, defense, space, medical, telecommunications and electronics industries through its Hollywood, Florida-based Flight Support Group and its Miami, Florida-based Electronic Technologies Group.