Edgewater Wireless applauds IEEE research paper

Edgewater Wireless Systems Inc. (YFI; TSX.V) (OTCQB: KPIFF), the developer of WiFi3â„¢ ultra-wideband, concurrent multi-channel WiFi chipsets, modular circuit cards, station units and access point products for high-density/high-interference wireless networks made to meet the challenge of large retailers, enterprise, hospitality and event venues, today highlights the important findings outlined in the research paper: IEEE 802.11ac: Effect of channel bonding on spectrum utilization in dense environments, the company said.

The paper is authored by Yousri Daldoul, Djamal-Eddine Meddour and Adlen Ksentini.

This IEEE (Institute of Electrical and Electronics Engineers) paper is a must-read for all WiFi experts, and is going to change the conversation regarding what is the most efficient use of WiFi spectrum in high density environments. This groundbreaking work by the IEEE lends credence to the spectral efficiency of Edgewater Wireless´ WiFi3 technology in high density WiFi networks.

Edgewater Wireless develops and commercializes edge technologies and intellectual property for the communications market. Edgewater Wireless delivers advanced product solutions designed to meet the high-density, high quality of service (QoS) and high-reliability needs of service providers and their customers. Leveraging over twenty-four (24) patents, Edgewater´s WiFi3â„¢ is redefining WiFi technology with its wide-band, multi-channel radio and high-capacity Access Point solutions, and delivering next generation WiFi, today.