Cadence Design Systems, Inc. (NASDAQ: CDNS) is expanding its collaboration with TSMC on an integrated design flow for TSMC´s advanced wafer-level Integrated Fan-Out (InFO) packaging technology, the company said.
The flow integrates IC-level with package design tools to provide a seamless flow with enhanced features for InFO technology, reducing overall design turnaround time. TSMC´s InFO technology can enable much more tightly coupled co-design and co-validation, simplifying heterogeneous integration of multiple dies.
Cadence enables global electronic design innovation and plays an essential role in the creation of today´s integrated circuits and electronics. Customers use Cadence software, hardware, IP and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems.
The company is headquartered in San Jose, Calif., with sales offices, design centers and research facilities around the world to serve the global electronics industry.