Airspan Networks Extends Collaboration with ON Semiconductor

Airspan Networks announced its collaboration with ON Semiconductor (Nasdaq: ON), driving energy efficient innovations, to capitalize on industry-leading Wi-Fi 6 performance solutions, utilizing the QCS-AX chipset for Fixed Wireless Access (FWA) applications, the company said.

With hundreds of thousands of sites deployed globally, Airspan is at the forefront of providing Communications Service Providers innovative wireless solutions for high-reliability public and private, urban, suburban and rural applications. Airspan delivers high-capacity, high-performance solutions that allow cost-effective, rapid deployment at scale.

Next-generation Airspan solutions will leverage ON Semiconductor´s QCS-AX Wi-Fi 6 family of chipsets. These products will maximize the benefits of the new Wi-Fi 6 standard including the additional spectrum in the 6 GHz band. The OFDMA-based 8×8 beamforming technology utilizing 160 MHz channels with modulation rates of 1024 QAM will significantly improve interference immunity, enabling higher-spectral efficiency and delivering multi-gigabit capacity.

FWA demands continue to advance where capacity and reliability are critical for day-to-day use in schools, hospitals, law enforcement, economic growth, etc. Airspan Networks is positioned to continue to address market needs and shape the networks of tomorrow.

Airspan is a US based multi-award winning 4G & 5G RAN vendor that supports fully virtualized cloud-native open architectures and boasts close to one million cells deployed in the most cutting-edge tier 1 networks and vertical applications across the globe. With an expansive product portfolio of indoor and outdoor, compact Femto, Pico, Micro and Macro base stations.

ON Semiconductor is a supplier of semiconductor-based solutions, offering a comprehensive portfolio of energy efficient, power management, analog, sensors, logic, timing, connectivity, discrete, SoC and custom devices. For more information, visit